Manufacturing Capabilities
Advanced manufacturing capabilities backed by state-of-the-art equipment, rigorous quality control, and expert technical teams.
Production Excellence
World-class manufacturing performance metrics
Technical Capabilities
Comprehensive manufacturing specifications and capabilities
Technical Capabilities
PCB Layer Count
1-32 layersFrom simple single-layer to complex HDI designs
Minimum Trace Width
0.075mm (3mil)Fine pitch capability for dense layouts
Via Size
0.1mm minimumMicro via and blind via technology
Board Size
0.2" x 0.2" to 20" x 28"Flexible sizing for various applications
Assembly Capabilities
Component Size
01005 to large connectorsUltra-fine pitch SMT assembly
Placement Accuracy
±0.02mmHigh precision component placement
BGA Pitch
0.4mm minimumFine pitch BGA and uBGA assembly
Lead Count
Up to 2000+ pinsComplex high-density packages
Quality Control
AOI Coverage
100% inspectionAutomated optical inspection on all assemblies
X-ray Inspection
2D/3D capabilityHidden solder joint inspection
ICT Testing
Full coverageIn-circuit testing for all critical nets
Functional Test
Custom fixturesApplication-specific testing protocols
Production Capacity
SMT Lines
12 production linesHigh-speed surface mount technology
Daily Capacity
50,000+ assembliesScalable production volumes
Lead Time
3-15 daysQuick turn and standard production
Shift Coverage
24/7 operationsRound-the-clock production capability
Equipment & Technology
State-of-the-art manufacturing equipment and inspection systems
SMT Equipment
Yamaha YSM20R
High-speed mounter152,000 CPH, 0.05mm accuracy
Panasonic NPM-W2
Modular mounter34,000 CPH, 01005 capability
JUKI KE-3020VL
Flexible mounterLED strips, odd-form components
Heller 1936 MKIII
Reflow oven10-zone convection, nitrogen capable
Inspection Equipment
Omron VT-M51
3D AOI systemFull 3D inspection, color analysis
Nordson DAGE XD7600NT
X-ray system2D/3D imaging, void analysis
Teradyne TestStation
ICT testerHigh-speed parallel testing
Keysight i3070
ICT systemBoundary scan, vector testing
PCB Fabrication
Via Drilling
Mechanical/Laser0.1-6.0mm diameter capability
Plating Lines
AutomatedCopper, HASL, ENIG, OSP finishes
Lamination Press
Vacuum pressMulti-layer stack-up to 32 layers
LDI Imaging
Laser direct2µm resolution, fine line capability
Quality Standards & Certifications
Internationally recognized quality management systems
ISO 9001:2015
Quality Management System
Design, development, and production of PCBs and assemblies
ISO 14001:2015
Environmental Management
Environmental protection and sustainable manufacturing
UL Listing
Safety Standards
Electrical safety and fire resistance testing
RoHS Compliance
Restriction of Hazardous Substances
Lead-free and environmentally safe processes
Manufacturing Process Flow
Streamlined workflow from design to delivery
Design Review
Design review and optimization recommendations
Material Procurement
Component sourcing and quality verification
PCB Fabrication
Multi-layer stack-up and surface finishing
SMT Assembly
Pick and place with precision placement
Through-hole
DIP insertion and wave/selective soldering
Testing & QC
AOI, ICT, functional, and final inspection
Packaging
ESD protection and secure shipping
Ready to Experience Our Capabilities?
Let our technical team review your project requirements and provide detailed capability matching and recommendations.