PCB Assembly
Professional SMT, through-hole, and mixed technology assembly services
Assembly Capabilities
0.1 - 4.0mm
PCB Thickness
L810*W490mm - L50*W50mm
PCB Size
Rigid PCB, FPC, Rigid-Flex, Aluminum PCB
Substrate Material
0.25mm (QFP/QFN/BGA)
Min Component Spacing
01005 (Imperial)
Min Component Size
Max 15mm
Component Height
±0.035mm
Placement Accuracy
7-8M Points
Daily Capacity
99.8%
Quality Rate
1~3 weeks
Turn Around
Assembly Technologies
SMT Assembly
Surface Mount Technology for high-density component placement
- 01005 to 50mm components
- Fine pitch BGA/QFN
- High-speed placement
- AOI inspection
Placement accuracy: ±25μm, Components: 01005-50mm
Through-Hole Assembly
Traditional assembly for robust mechanical connections
- DIP components
- Wave soldering
- Selective soldering
- Manual insertion
Hole size: 0.2-6.0mm, Lead diameter: 0.3-3.0mm
Mixed Assembly
Combination of SMT and through-hole technologies
- Optimized process flow
- Reduced handling
- Cost effective
- Single pass solution
Complete assembly in optimized sequence
BGA Assembly
Ball Grid Array and advanced packaging solutions
- uBGA to large BGA
- X-ray inspection
- Rework capability
- Underfill process
Pitch: 0.3-1.27mm, Package: up to 55mm