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Suntop Electronics

PCB Manufacturing

Advanced PCB manufacturing with cutting-edge technology and rigorous quality control

Manufacturing Capabilities

State-of-the-art equipment and proven processes for all PCB types

Layer Count

Single Layer1 Layer
Double Layer2 Layers
Multi-Layer4-30 Layers
HDIUp to 20 Layers

Board Thickness

Minimum0.1mm
Standard0.4-2.4mm
Maximum4.3mm
Tolerance±10%

Via Technology

Through Via0.1-6.0mm
Blind Via0.1-0.2mm
Buried Via0.1-0.2mm
Microvia0.05-0.15mm

Surface Finish

HASLLead & Lead-free
ENIG0.05-0.15μm Au
OSPOrganic Coating
Immersion Silver0.15 - 0.30μm

PCB Types We Manufacture

Comprehensive range of PCB technologies for every application

Rigid PCB

Rigid PCB

Traditional solid PCBs for standard applications

Key Features:

  • Cost-effective
  • High reliability
  • Standard processes
  • Quick turnaround

Applications:

Consumer electronicsIndustrial controlsAutomotiveTelecommunications
HDI PCB

HDI PCB

High Density Interconnect for miniaturization

Key Features:

  • Microvia technology
  • Fine line width
  • High component density
  • Signal integrity

Applications:

Mobile phonesTabletsLaptopsIoT devices
Flex PCB

Flex PCB

Flexible circuits for space-constrained applications

Key Features:

  • Bendable design
  • Space saving
  • Reduced weight
  • Dynamic flexing

Applications:

WearablesMedical devicesAerospaceMobile devices
Rigid-Flex PCB

Rigid-Flex PCB

Combination of rigid and flexible sections

Key Features:

  • 3D packaging
  • Reduced connectors
  • Improved reliability
  • Complex designs

Applications:

SmartphonesCamerasMilitarySpace applications

Our Manufacturing Process

Systematic approach ensuring consistent quality and timely delivery

1

Design Review & DFM

1-2 Days

Thorough analysis of your design files and manufacturing optimization recommendations.

2

Material Preparation

1-2 Days

Selection and preparation of substrate materials according to specifications.

3

Layer Stackup & Drilling

1-3 Days

Precise layer alignment and high-accuracy drilling operations.

4

Plating & Etching

2-3 Days

Copper plating, pattern etching, and circuit formation.

5

Solder Mask & Silkscreen

1-2 Day

Application of solder mask and component labeling.

6

Surface Finish & Testing

1-2 Day

Final surface treatment and comprehensive electrical testing.

Quality Standards & Certifications

Compliance with international standards and industry best practices

IPC-6012

Qualification and Performance Specification for Rigid PCBs

IPC-6013

Qualification and Performance Specification for Flexible PCBs

IPC-6018

Microwave End Product Board Inspection and Test

ISO 9001:2015

Quality Management Systems

ISO 14001:2015

Environmental Management Systems

UL 94V-0

Flammability Rating for Plastic Materials

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