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(76 reviews)
HDI
HDI PCB
High Density Interconnect boards with microvias for miniaturized high-performance devices
Key Features
Microvias
Laser drilled ≤0.15mm
High Density
Fine pitch components
Any Layer HDI
Advanced interconnect
Via-in-Pad
Maximum routing density
Specifications
| Via Size | 0.05mm - 0.15mm |
| Layer Count | Up to 20+ layers |
| Min Trace | 0.075mm (3mil) |
| Build-up | 1+N+1 to 4+N+4 |
| Applications | Smartphones, Tablets, IoT |